Haefliger, D.3; Nordstrøm, M.3; Rasmussen, Peter Andreas1; Boisen, Anja4
1 Department of Micro- and Nanotechnology, Technical University of Denmark2 Bioprobes, Department of Micro- and Nanotechnology, Technical University of Denmark3 unknown4 Center for Intelligent Drug Delivery and Sensing Using Microcontainers and Nanomechanics, Center, Technical University of Denmark
We present a simple dry release technique which uses a thin fluorocarbon film for efficient removal of plastic microdevices from a mould or a handling substrate by reducing the adhesion between the two. This fluorocarbon film is deposited on the substrate in an advanced Si dry etch device utilising the C4F8 passivation plasma. Micromachined polymer chips made of SU-8 are removed from the handling substrate by lifting them off using mechanical tweezers. Effective release of chips of several mm(2) size within a few seconds and the lift-off of fragile, 5.5-mu m-thin cantilevers at a yield of almost 100% were demonstrated on wafer-scale. The fluorocarbon film showed excellent compatibility with metal etch processes and polymer baking and curing steps. It further facilitates demoulding of polydimethylsiloxane stamps suitable for soft-lithography.
Microelectronic Engineering, 2005, Vol 78-79, p. 88-92