Kistrup, Kasper1; Poulsen, Carl Esben1; Hansen, Mikkel Fougt1; Wolff, Anders1
1 Department of Micro- and Nanotechnology, Technical University of Denmark2 Magnetic Systems, Department of Micro- and Nanotechnology, Technical University of Denmark3 BioLabChip, Department of Micro- and Nanotechnology, Technical University of Denmark
Ultrasonic welding is a rapid, promising bonding method for the bonding of polymer chips; yet its use is still limited. We present two lab-on-a-chip applications where ultrasonic welding can be preferably applied: (1) Self-aligned gapless bonding of a two-part chip with a tolerance of 50 um; (2) bonding of a large area shallow chamber (1.8 cm^2 X 150 um). Using injection moulding combined with ultrasonic welding we achieved a total production and bonding time of 60 s per chip, and a batch of chips could be produced within a day going from design to finished chips. We believe that the technical solutions offered here can significantly help bridge the gap between academia and industry, where the differences in production methods and materials pose a challenge when transferring technology.