2-D Row-Column CMUT Arrays with an Open-Grid Support Structure

Thomas Lehrmann Christiansen; Christian Dahl-Petersen; Jørgen Arendt Jensen; Erik Vilain Thomsen

doi:10.1109/ULTSYM.2013.0436

2-D Row-Column CMUT Arrays with an Open-Grid Support Structure

Authors:

Christiansen, Thomas Lehrmann ;
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Department of Micro- and Nanotechnology, Technical University of Denmark
Dahl-Petersen, Christian ;
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Technical University of Denmark
Jensen, Jørgen Arendt ;
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0000-0002-7896-3136
Department of Electrical Engineering, Technical University of Denmark
Thomsen, Erik Vilain
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0000-0002-2772-926X
Department of Micro- and Nanotechnology, Technical University of Denmark

DOI:

10.1109/ULTSYM.2013.0436

Abstract:

Fabrication and characterization of 64 + 64 2-D row-column addressed CMUT arrays with 250 μm element pitch and 4.4 MHz center frequency in air incorporating a new design approach is presented. The arrays are comprised of two wafer bonded, structured silicon-on-insulator wafers featuring an opengrid support structure on top of the CMUT plates, omitting the need for through wafer vias. A 5 mask process is used to produce 2-D row-column addressed CMUT arrays with 74 nm vacuum gaps, single crystalline silicon plates with optional lithographically defined mass loads, 120 V pull-in voltage, and high voltage insulation up to 310 V.

ISBN:

9781467356862

Type:

Conference paper

Language:

English

Published in:

2013 Ieee International Ultrasonics Symposium Proceedings, 2013, p. 1712-1715

Keywords:

Fields, Waves and Electromagnetics; Bonding; Electrodes; Insulation; Resonant frequency; Silicon-on-insulator; Voltage measurement

Main Research Area:

Science/technology

Publication Status:

Published

Review type:

Peer Review

Conference:

2013 IEEE International Ultrasonics Symposium, 2013

Publisher:

IEEE

Submission year:

2013

Scientific Level:

Scientific

ID:

259789161

2-D Row-Column CMUT Arrays with an Open-Grid Support Structure

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