Christiansen, Thomas Lehrmann1; Dahl-Petersen, Christian5; Jensen, Jørgen Arendt3; Thomsen, Erik Vilain1
1 Department of Micro- and Nanotechnology, Technical University of Denmark2 MEMS-AppliedSensors, Department of Micro- and Nanotechnology, Technical University of Denmark3 Department of Electrical Engineering, Technical University of Denmark4 Center for Fast Ultrasound Imaging, Center, Technical University of Denmark5 Technical University of Denmark
Fabrication and characterization of 64 + 64 2-D row-column addressed CMUT arrays with 250 μm element pitch and 4.4 MHz center frequency in air incorporating a new design approach is presented. The arrays are comprised of two wafer bonded, structured silicon-on-insulator wafers featuring an opengrid support structure on top of the CMUT plates, omitting the need for through wafer vias. A 5 mask process is used to produce 2-D row-column addressed CMUT arrays with 74 nm vacuum gaps, single crystalline silicon plates with optional lithographically defined mass loads, 120 V pull-in voltage, and high voltage insulation up to 310 V.
2013 Ieee International Ultrasonics Symposium Proceedings, 2013, p. 1712-1715
Fields, Waves and Electromagnetics; Bonding; Electrodes; Insulation; Resonant frequency; Silicon-on-insulator; Voltage measurement
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2013 IEEE International Ultrasonics Symposium, 2013