- Authors:
- DOI:
- 10.1109/ULTSYM.2013.0436
- Abstract:
- Fabrication and characterization of 64 + 64 2-D row-column addressed CMUT arrays with 250 μm element pitch and 4.4 MHz center frequency in air incorporating a new design approach is presented. The arrays are comprised of two wafer bonded, structured silicon-on-insulator wafers featuring an opengrid support structure on top of the CMUT plates, omitting the need for through wafer vias. A 5 mask process is used to produce 2-D row-column addressed CMUT arrays with 74 nm vacuum gaps, single crystalline silicon plates with optional lithographically defined mass loads, 120 V pull-in voltage, and high voltage insulation up to 310 V.
- ISBN:
- 9781467356862
- Type:
- Conference paper
- Language:
- English
- Published in:
- 2013 Ieee International Ultrasonics Symposium Proceedings, 2013, p. 1712-1715
- Keywords:
- Fields, Waves and Electromagnetics; Bonding; Electrodes; Insulation; Resonant frequency; Silicon-on-insulator; Voltage measurement
- Main Research Area:
- Science/technology
- Publication Status:
- Published
- Review type:
- Peer Review
- Conference:
- 2013 IEEE International Ultrasonics Symposium, 2013
- Publisher:
- IEEE
- Submission year:
- 2013
- Scientific Level:
- Scientific
- ID:
- 259789161
0000-0002-7896-3136
