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2-D Row-Column CMUT Arrays with an Open-Grid Support Structure

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Authors:
  • Christiansen, Thomas Lehrmann ;
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    Department of Micro- and Nanotechnology, Technical University of Denmark
  • Dahl-Petersen, Christian ;
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    Technical University of Denmark
  • Jensen, Jørgen Arendt ;
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    Orcid logo0000-0002-7896-3136
    Department of Electrical Engineering, Technical University of Denmark
  • Thomsen, Erik Vilain
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    Orcid logo0000-0002-2772-926X
    Department of Micro- and Nanotechnology, Technical University of Denmark
DOI:
10.1109/ULTSYM.2013.0436
Abstract:
Fabrication and characterization of 64 + 64 2-D row-column addressed CMUT arrays with 250 μm element pitch and 4.4 MHz center frequency in air incorporating a new design approach is presented. The arrays are comprised of two wafer bonded, structured silicon-on-insulator wafers featuring an opengrid support structure on top of the CMUT plates, omitting the need for through wafer vias. A 5 mask process is used to produce 2-D row-column addressed CMUT arrays with 74 nm vacuum gaps, single crystalline silicon plates with optional lithographically defined mass loads, 120 V pull-in voltage, and high voltage insulation up to 310 V.
ISBN:
9781467356862
Type:
Conference paper
Language:
English
Published in:
2013 Ieee International Ultrasonics Symposium Proceedings, 2013, p. 1712-1715
Keywords:
Fields, Waves and Electromagnetics; Bonding; Electrodes; Insulation; Resonant frequency; Silicon-on-insulator; Voltage measurement
Main Research Area:
Science/technology
Publication Status:
Published
Review type:
Peer Review
Conference:
2013 IEEE International Ultrasonics Symposium, 2013
Publisher:
IEEE
Submission year:
2013
Scientific Level:
Scientific
ID:
259789161

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