The in-plane Young’s modulus of a CSM E-glass/epoxy material is characterised through the use of dynamic mechanical analysis (DMA). The measured data is used to generate material models which describe the property behaviour as a function of conversion and temperature. Gelation of the epoxy resin plays a major role in the modulus development and is measured directly on the glass/epoxy material. The Young’s modulus is described through a bi-functional model including the liquid/solid transition of the material. The evolution of Young’s modulus is modelled by decoupling modulus increments caused by time and temperature, and is graphically illustrated through a Modulus-Temperature- Transformation (MTT) diagram. Based on the established material models presented in this paper and models in Part-1, it is feasible to assess residual stresses and shape distortions of composite parts made from this glass/epoxy material.
Polymer Testing, 2013, Vol 32, Issue 8, p. 1417-1422
Composite, Thermal analysis, Material models, Curing