1 Department of Electrical Engineering, Technical University of Denmark2 Electromagnetic Systems, Department of Electrical Engineering, Technical University of Denmark3 Ferdinand-Braun-Institut4 Leibniz-Institut für innovative Mikroelektronik
This paper presents a novel InP-SiGe BiCMOS technology using wafer-scale heterogeneous integration. The vertical stacking of the InP double heterojunction bipolar transistor (DHBT) circuitry directly on top of the BiCMOS wafer enables ultra-broadband interconnects with <0.2 dB insertion loss from 0-100 GHz. The 0.8 × 5 μm2 InP DHBTs show fT/fmax of 400/350 GHz with an output power of more than 26 mW at 96 GHz. These are record values for a heterogeneously integrated transistor on silicon. As a circuit example, a 164-GHz signal source is presented. It features a voltage-controlled oscillator in BiCMOS, which drives a doubler-amplifier chain in InP DHBT technology.
I E E E Transactions on Electron Devices, 2013, Vol 60, Issue 7, p. 2209-2216