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A rapid process of Yba<sub>2</sub>Cu<sub>3</sub>O<sub>7-δ</sub> thin film fabrication using trifluoroacetate metal-organic deposition with polyethylene glycol additive

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Authors:
  • Wu, Wei ;
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    Tsinghua University
  • Feng, Feng ;
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    Tsinghua University
  • Shi, Kai ;
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    Tsinghua University
  • Zhai, Wei ;
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    Tsinghua University
  • Qu, Timing ;
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    Tsinghua University
  • Rongxia Huang ;
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    Technical University of Denmark
  • Xiao, Tang ;
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    Department of Energy Conversion and Storage, Technical University of Denmark
  • Wang, Xiaohao ;
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    Tsinghua University
  • Hu, Qingyu ;
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    Tsinghua University
  • Grivel, Jean-Claude ;
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    Orcid logo0000-0001-7835-9054
    Department of Energy Conversion and Storage, Technical University of Denmark
  • Han, Zhenghe
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    Tsinghua University
DOI:
10.1088/0953-2048/26/5/055013
Abstract:
Trifluoroacetate metal-organic deposition (TFA-MOD) is a promising technique to fabricate YBa2Cu3O7-δ (YBCO) superconducting films. However, its slow pyrolysis process, which usually takes more than 10 h, constitutes a barrier for industrial production. In this study, polyethylene glycol (PEG) was utilized to reduce the stress generation inside the coated films when the strong pyrolysis reactions happen. With the addition of 30 wt% PEG2000 to the precursor solution, a smooth film surface could be obtained through a rapid pyrolysis process of 15 min. After the optimizations of the crystallization and oxygenation processes, mass percentage and molecular weight of PEG additive, YBCO thin films with Jc of about 4.5 MA cm-2 (77 K, self-field) could be routinely fabricated using (20-30) wt% PEG(1000-2000) additive with a total treatment time of about 2 h including the 15 min pyrolysis process time. The effects of PEG additive were discussed using one of the mechanisms of buckling formation. The reduction of compressive stress by PEG additive was suggested to be the reason for preventing buckling.
Type:
Journal article
Language:
English
Published in:
Superconductor Science and Technology, 2013, Vol 26, Issue 5
Main Research Area:
Science/technology
Publication Status:
Published
Review type:
Peer Review
Submission year:
2013
Scientific Level:
Scientific
ID:
241128897

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