Thermal treatment of chromated copper arsenate (CCA) impregnated waste wood is a way to utilize the energy resource of the wood and at the same time to reduce the volume of the waste. An issue of concern in relation to the thermal treatment is As emission to the air. Meanwhile, there is still a matter to cope with when methods to avoid As emission are implemented: the residues with increased concentrations of Cu, Cr and As. In the present paper two different residues after thermal treatment are characterized: a mixed bottom and fly ash from combustion of CCA impregnated wood, and a charcoal from pyrolysis of treated waste wood. By SEM/EDX it was seen that the charcoal still showed wood structure with both tracheids and rays and that Cu, Cr and As were found inside this wood structure. Cu was found alone while Cr and As were often found together. By chemical analysis it was found, too, that the charcoal contained a high concentration of Zn, probably from paint. Chemical extraction experiments in HNO were conducted with the charcoal and it was found that the order of extraction (in percentage) was Zn > Cu > As > Cr. A SEM/EDX investigation of the mixed ash from combustion showed the presence of small particles with wood structure with elevated Cu and Cr concentrations, but most particles were irregular shaped matrix particles rich in Si, Al and K. Cr was abundant in many different particles including the lignin skeleton of the small, unburned wood pieces, but also inside silica-based matrix particles. Ca was often found associated with char-like (porous) particles, indicating that Ca-arsenates had been formed during combustion. Cu was often associated with Cr in the unburned wood pieces, whereas it was less abundant inside the silica-based matrix particles. Cu was also found in an almost pure form in a small layer on the surface of some matrix particles indicating condensation of volatile Cu species. Chemical extraction with inorganic acids showed the order of percentages mobilized as: As > Cu > Cr.
Wood Science and Technology, 2005, Vol 39, Issue 2, p. 87-98