The main issue of this thesis is the combination of electrochemical deposition of metals and micro machining. Processes for electroplating and electroless plating of nickel and nickel alloys have been developed and optimised for compatibility with microelectronics and silicon based micromechanics. The principles of general electrochemistry, electroplating, alloy plating, pulse plating and electroless plating are discussed, as well as measurement methods and improve-ment of important properties such as internal stress, material distribution, mechanical properties and magnetic properties. The use of electrochemical machining and traditional machining is compared to micro machining techniques as performed in the field of microelectronics. Various practical solutions and equipment for electrochemical deposition of micro components are demonstrated, as well as the use and experience obtained utilising commercial processes for selective etching of copper and gold and for electroplating of gold and indium.